Raman amplifiers are expected to achieve optical power levels in excess of +30 dBm. This represents a four to eight-fold increase in power level over systems presently being deployed. At these power levels, there is increased risk of performance degradation from damage to transmitting components that include connectors, splices, and attenuators. To evaluate the effects of higher power levels, a test facility was upgraded to provide +30dBm of optical power using a Raman amplifier. Connectors, splices, and attenuators were evaluated at power levels of +30 dBm for short-term stability, mating durability, disconnecting/reconnecting under power, and long-term stability. Evaluations were made at 1535 and 1560 nm to simulate the range of wavelengths used in current C-band systems. Most evaluations were made at the 1535 nm wavelength where the fiber mode-field radius is smallest and the power density the highest for current operating systems. Components evaluated include the STII, SC, and LC connectors, the Rotary Mechanical Splice, and two different LC attenuator designs.|Raman amplifiers are expected to achieve optical power levels in excess of +30 dBm. This represents a four to eight-fold increase in power level over systems presently being deployed. At these power levels, there is increased risk of performance degradation from damage to transmitting components that include connectors, splices, and attenuators. To evaluate the effects of higher power levels, a test facility was upgraded to provide +30dBm of optical power using a Raman amplifier. Connectors, splices, and attenuators were evaluated at power levels of +30 dBm for short-term stability, mating durability, disconnecting/reconnecting under power, and long-term stability. Evaluations were made at 1535 and 1560 nm to simulate the range of wavelengths used in current C-band systems. Most evaluations were made at the 1535 nm wavelength where the fiber mode-field radius is smallest and the power density the highest for current operating systems. Components evaluated include the STII, SC, and LC connectors, the Rotary Mechanical Splice, and two different LC attenuator designs.

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